PRODUCTS

Loop Heat Pipes (LHP) consists of the three key elements: evaporator, condenser and two pipes (vapor and liquid). Our LHP can handle servers / chips of the multiple brands in wide range of power from 50W to 950W with no modification in evaporator or condenser structures. There are only two variable elements we use to maintain LHP compatibility with our clients’ server topology:
– chip interface
– pipes bending

Same way as a traditional heat sinks LHP evaporators are equipped by chip interface according to socket standard. Such level of unification makes possible for LHP to be compatible with any chip / chipset.

Chip standard interface also makes Loop Heat Pipes server integration one (for new) and four (for retrofitted) steps simple process. Specifically for retrofitted servers, integrator needs to:
– open server
– remove heat sink
– attached LHP
– close server

Server topology, including a number of CPUs / GPUs, is another factor which varies from client to client. This element is address by pipes topology and bending.  Pipes modification may require 2-3 weeks of 3D modelling before manufacturing and shipping LHP to the customers.

We experienced Loop Heat implementation for a variety of the servers brands, including, but not limited, HPE, Dell, SuperMicro, Gigabyte, IBM and the multiple OCP servers. Details of implementation can be found in OCP Passive Direct Liquid Cooling Specification here

Our manifold maintains a further heat remove from the condenser of the Loop Heat Pipes and an ability of server quick disconnection from the cooling scheme. It can be either a part of the interface with adiabatic cooler or a connector to the heat re-use scheme. There are two types of manifolds we use:

• Quick Disconnect Dry Lock connection Manifold (QD Dry Lock Manifold)

• Quick Disconnect Blind-Mate connections Manifold (QD Blind-Mate Manifold)

QD Dry Lock Manifold is a rectangular section tube integrated with Facility Water System (FWS). Condensers are connected to this manifold mechanically using simple clamps. Because of it condensers / manifold positioning have a very high vertical tolerance.

QD Blind-Mate Manifold  is a specially shaped tube with a special cavities along their length for condensers to be inserted into them. It is also integrated with Facility Water System (FWS). This particular implementation requires a higher accuracy of condensers / manifold mutual positioning. 

Rack Manifold details are available as a part of the follow OCP Specifications:

 – Passive Direct Liquid Cooling based on Loop Heat Pipes here

 – 350kW Modular Data Center with the Passive Cooling System here

Even though servers generate the most heat inside a data center, thermal management is equally important for network devices such as top-of-the-rack switches. This is related with the growing power of the chips inside switches in combination with flat and highly packed internal structure of the switches.

With this in mind we are working with a number of switches manufacturing companies to deliver up to 500-1000W future switches to the data centers.