SOLUTIONS

COMPLETE SET OF DATA CENTER COOLING SOLUTIONS

Green Loop Cooling through its own products and in partnership with leading thermal management equipment and service providers deliveries a complete set of energy efficient and environmentally friendly cooling solutions covering all aspects of data center cooling from IT equipment to data center facilities, including heat reuse applications.

We believe that liquid cooling is an inevitable replacement for air cooling. We appreciate the endless efforts of our colleagues from the active liquid cooling and immersion cooling segments to educate the data center industry and to promote liquid cooling. To clarify our positioning on the market we are comparison to cold plate and immersion approaches to the each section below.

PASSIVE DIRECT LIQUID COOLING (PDLC) FOR IT EQUIPMENT

The best way to explain a new things is to compare them with the well known things. We will use Active Direct Liquid Cooling (Cold Plates) as a golden standard to present our solutions to you.

Specially selected refrigerant is pumped through the IT equipment to the cold plates attached to the heat source in Active Direct Liquid Cooling scheme. Liquid speed is controlled by Central Distribution Unit (CDU). Specially tailored dripless connectors maintain a leakage protection.  Some companies adding two-phase transition or negative pressure to this standard scheme.

Passive Direct Liquid Cooling maintains a heat transfer from inside of IT equipment to outside of it where a heat dissipation will be much easy to organize. Unlike Active Direct Liquid Cooling (Cold Plates ) this transfer does not require pumping and energy – PDLC uses two phase transition and capillary forces for it.

Green Loop Cooling utilizes advantages of LHP providing the best cooling solution for the data center IT equipment, which:

 – has high thermal load management capacity

 – maintains long distance of heat transport

 – does not require service or maintenance

The modern and innovative methods of manufacturing makes PDLC cost-effective with low CAPEX, OPEX and TCO.

ISSUES YOU WILL FORGET WITH PASSIVE DIRECT LIQUID COOLING

Passive Direct Liquid Cooling does not required a lot of elements presented in Active Direct Liquid Cooling scheme.

Specifically you don’t need:

  • CDU: speed of liquid – vapor cycle is controlled by the temperature on evaporator and condenser automatically
  • Special refrigerant selection: we mostly use water or ammonia
  • Pumps: phase transition and capillary forces drive liquid within LHP
  • Dripless connectors: PDLC loop is closed and connection to manifold is dry

As the results you have:

  • No risk of leakage because of capillary forces and negative pressure
  • No service or maintenance because of moving parts absence and simplicity
  • And, finally, no energy or water wasting for cooling of your IT equipment.

IN-RACK AND DATA CENTER FACILITY LEVEL INTEGRATION

We believe in simplicity as both solution feature and a base of the customer comfort. This is the reason we created a simple version of manifold both supporting quick disconnect (QD).

Manual QD (“drylock”) uses claps to attach condensers to the manifold mechanically. Specific position of each condenser does not matter and precision of manifold vertical position is not critical. Manifold itself is either a combination of the tubes with rectangular section or a flat shell wrapped around a set of regular circle section pipes.   If server need to be disconnected / connected to the manifold condenser should be un-clapped or clapped back from / to manifold. TCM can be used on each condenser surface to increase thermal conductivity.

Blind-mate QD is organized via a combination of the special loop heat pipe condenser shapes and corresponding  set of cavities on the manifold. Natural friction with applied TCM maintains the connection / disconnection process for blind-mate QD. Since each condenser should be inserted into the specific cavity on the manifold thus manifold positioning becomes a more critical point for the implementation. Manifold should be a pipe (flat or round) with cavities made in advance as a part of the manufacturing process.

MODULAR AND EDGE DATA CENTERS

A modular approach helps data centers to improve an implementation process and a scalability. This is the reason we developed OCP Modular Data Center specification. Using standard size module we are able to handle up to 1080 OCP server with total power of 350kW in our MDC.

We are also paying a lot of attention to the EDGE data center segment. The passive nature of our cooling helps us to have non-serviceable EDGE DCs with high IT load working in the wide range of temperatures.

 

HEAT REUSE

Heat reuse is the strategic direction in our business and technological development. We believe that data centers can serve society providing heat for buildings and industrial facilities across the world.